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The process of modularization and intelligence of power devices has actually been around for a long time. With the advancement of integration technology, in addition to power devices, the module also integrates corresponding interface circuits, protection circuits (including over-current, over-voltage, under-voltage and overheat protection, etc.) and drive circuits, usually called intelligent power modules. (IPM). If the control circuit is also integrated into the power module, the so-called power integrated circuit (PIC) will be formed. This is the perfect combination of microelectronics technology and power electronics technology. It is a major advancement in power electronics technology and has been used in many application fields. shows great advantages. However, it should be pointed out that whether it is IPM or PIC, due to the influence of various factors such as electricity, heat, and magnetism in the module, especially the influence of passive devices such as inductance and capacitance, the integrated power level and the formation of integrated The power conversion device is still very limited.